A metal or solder based solution provides many benefits such as:
Applications:
As technology drivers push electronics and semiconductors for greater functionality, this affects proportionally the technology improvement demand for thermal dissipation or interface materials. Kester has devoted resources to develop the next generation of TIM’s and innovative non-adhesive options. An example of a high performance application in which the traditional organic technology has approached the typical iterative improvement cycle is with microprocessors. The next generation of TIM’s to support further thermal dissipation performance goals has concluded that TIM solutions by Kester is the interconnect solution.
Whether your thermal dissipation issues lie at the die level or at TIM2, Kester has created interconnect solutions to enable your next generation applications.
Note: TIM2 is referred to the thermal management material solution between the heat spreader/lid to an active or passive heat sink. The heat sinks, whether active or passive, are used to dissipate the heat generated by a microprocessor.
Another application space of solder based thermal management solutions from Kester is in the area of die attach for Metal Oxide Semiconductor Field Effect Transistor (MOSFET).
The high purity and consistency of materials supplied by Kester has become the defacto standard specification for global Semiconductor packaging corporations.
