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Wave Soldering Flux


Kester's Wave Soldering Fluxes meets the demands of critical soldering applications and requirements. Kester offers no-clean, water-soluble, rosin, and VOC-free chemistries for your specific soldering needs. Kester's no-clean fluxes provide an environmentally safe alternative while reducing costs for cleaning, energy expenditure and waste disposal.

The no-clean VOC-free fluxes are water-based, halide-free and free of ozone depleting chemicals. Kester also produces a wide selection of water-soluble fluxes (including VOC-free), which provides greater fluxing ability and a larger process window than traditional rosin based fluxes.

The flux residues are designed to be removed with either in-line or batch hot water cleaning processes. Kester's entire line of liquid fluxes provide a perfect solution for automated wave soldering that will increase reliability, reduce costs, and remain environmentally safe while meeting critical requirements.

Liquid Flux


Kester's line of liquid fluxes meets the demands of critical soldering applications and requirements. Kester offers no-clean, water-soluble, rosin, and VOC-free chemistries for your specific soldering needs.

Kester's no-clean fluxes provide an environmentally safe alternative while reducing costs for cleaning, energy expenditure, and waste disposal. The no-clean VOC-free fluxes are water-based, halide-free and free of ozone depleting chemicals.

Kester also produces a wide selection of water-soluble fluxes (including VOC-free), which provides greater fluxing ability and a larger process window than traditional rosin based fluxes. The flux residues are designed to be removed with either in-line or batch hot water cleaning processes.

Kester's entire line of liquid fluxes provide a perfect solution for dip and hand soldering that will increase reliability, reduce costs and remain environmentally safe while meeting critical requirements.

 Epoxy Flux


Kester's Epoxy Fluxes are a No-Clean Polymer Flux (NPF) representing an innovative approach for lead-free flip-chip attachment for high-performance electronic packages. Kester's Epoxy Fluxes are a multi-functional material that is a drop-in replacement for water washable or no clean Tacky Soldering Fluxes (TSF). These NPF's are intended for use with a thin film applicator (rotating drum or slide). The residues resulting from the attach process form a polymer film at the base of the soldered joint and enhance the mechanical bond between underfill and substrate. These residues can also crosslink with high-performance capillary underfill systems.

Benefits
Kester Epoxy Fluxes are intended to enhance process yield and reliability for high-end flip-chip-in-package applications such as ASICs, DSP chips and high-power microprocessors. These Epoxy Fluxes provide many unique advantages to the user; it is the first flux to be designed in conjunction with leading underfill materials, not designed separately with material interactions as an afterthought.

Kester Epoxy Fluxes are also designed to increase the mechanical integrity of the flux/underfill system while eliminating the cleaning process associated with water-washable TSF. Kester's Epoxy Fluxes facilitates soldering to difficult to wet substrate finishes as well as enhancing the flow of capillary underfill materials that help to eliminate entrapment voids associated with interrupted flow. Kester Epoxy Fluxes provide exceptional reliability for large, high I/O count die in packages requiring the highest reliability levels when used with compatible underfill systems.

 

Ball Chip Attach Flux


Kester's Ball Chip Attach Fluxes (no-clean and water-soluble) are designed as a Lead-Free Solution for an array of Lead-Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead-Free soldering application that requires a very tacky flux.

Kester's hundred plus years of experience in soldering technology understands the challenge associated with developing Ball Chip Attach Flux solder tailored to your specific needs and requirements. With Kester ball chip attach solder, process engineers will have access to the most complete line of standard and unique die attach materials backed by Kester's unsurpassed experience in soldering technology.

Water-Soluble Paste Flux Performance Characteristics:

No-Clean Paste Flux Performance Characteristics: