With kester's Die Attach wire and solder paste, process engineers will have access to the most complete line of standard and unique die attach materials backed by Kester's unsurpassed experience in soldering technology.
High activity no-clean paste specifically engineered to provide excellent solderability to lead free component and board finishes. Consistent print volume regardless of process parameters and 0201 application capable. Wide reflow process window. Compatible with enclosed print head systems.
Kester's hundred plus years of experience in soldering technology understands the challenge associated with developing die attach solder tailored to your specific needs and requirements. With Kester Die Attach Wire and Die Attach Solder Paste, process engineers will have access to the most complete line of standard and unique die attach materials backed by Kester's unsurpassed experience in soldering technology.
Kester Die Attach Solder Paste is designed to dispense consistent size deposits in automated dispensing equipment. These pastes offer excellent wetting capabilities and low voiding with minimal attention to profiling. Our high purity electronic packaging materials produce improved results in your most challenging applications. Regardless of your requirements let Kester tailor a specific process solution that's right for your application.
Kester Die Attach Wire maintains high tolerance levels, which are critical for proper volume deposits. Kester's advanced proprietary processes and extremely high quality standards ensure the manufacturing of crucial diameters and tolerances.
