Working with some of the world's largest sub-contract assemblers and OEMs here in the fast-paced Silicon Valley environment places HEPCO in a unique position in the industry.   

HEPCO has recently expanded its line to include PCB de-paneling equipment for routed PCBs.  Also introduced is a new BGA Sphere Placement System which uses vacuum pick-up and placement of spheres for an entire array at once, and provides a mechanically-correct method of bumping or reballing BGA components. Please feel free to contact us if you should have any questions regarding our products and services.

LEAD CUTTING AND FORMING PRODUCTS:

·  1500-1 Radial Lead Trimming Machine

·  Bowl-Fed Bowl Feeder System

·  1700-2 Radial Lead Trimming Machine (.500" & 15mm Perforated Tape)

·  1800-1 Radial Lead Forming & Cutting Machine (for Taped Components)

·  3000-2 Manual Lead Forming & Cutting  Machine

·  T3700-1 Radial Lead Shear Machine

·  6200-1/6500-1 Universal Lead Forming & Cutting Machines

·  DIP Lead Cutters

·  DIP Lead Formers

·  8000-1 Axial Lead Former

BALL-GRID ARRAY (BGA) & PCB DEPANELING EQUIPMENT:

• 1200-1 Routed PCB Depaneler
• 9000-1 BGA Sphere Placement System
• Solder Spheres & Flux

LEAD-FREE & RoHS/WEEE COMPLIANCE EQUIPMENT:

• LeadHound© HEPCO LeadHound© Lead-Free and RoHS/WEEE Compliance Verification System

CUSTOM DIE SETS:

• Our Most Popular Configurations 
• Custom Ordering Special Die Sets
• Used/Demo Die Sets