Core Technology Competency
Selective Assembly - BeamWorks has developed a state-of-the-art laser-based assembly platform, which solves the major bottleneck issues in the multi-billion dollar PCB assembly business. BeamWorks unique solution integrates three SMT assembly features in one platform: solder paste dispensing, pick & place, and laser soldering.
Selective Soldering of Through-Hole Components - BeamWorks has developed an in-line selective soldering system that utilizes a power controlled diode laser with closed loop temperature and solder volume control for the soldering of through-hole components. The soldering is carried out from the bottom of the board, which eliminates the need to flip the board prior to the soldering process.
Laser Soldering
Current soldering techniques are based on forced convection through reflow ovens. In addition to the considerable floor space they take up, the reflow process is a non-specific technology that involves heating the entire PCB card, causing thermal distortions and lack of uniformity.
BeamWorks has developed a core competency that is truly a breakthrough technique in soldering electronic components. Based on high-powered, low-cost diode lasers, BeamWorks' laser-based heat source is programmed to achieve the precise intensity, direction and position required for each and every solder joint. In consequence, only the joint receives the energy and not all the component. There is no overheating of the component or the PCB. This core technology is deployed with multi-channel laser capabilities (up to four independent laser beams in the Spark 400) that can provide simultaneous, fully synchronized soldering capability, which increases soldering throughput, by a factor of 4. This is a fully synchronized, multi-process technology, which incorporates visual alignment for very precise soldering.
Through-hole laser soldering differs from wave or mini wave soldering, because in through-hole laser soldering a small clearance is adequate between the soldered component and the adjacent component, while in wave soldering adjacent components with small clearance need to be masked to prevent bridging.In BeamWorks' selective soldering system, the soldering is carried out from the bottom of the board. Soldering from the bottom of the board eliminates the need to flip the board over prior to the soldering process or to use supporting fixtures.
Dispensing
The dispenser unit used in BeamWorks selective assembly system is a rotary micro valve, which is a self contained fluid dispensing valve, capable of depositing small accurate shots or continuous beads of solder. The valve dispenses fluid material with a positive displacement action that is based on a rotary feed screw (auger) mechanism. Material is constantly present at the inlet of the feed screw and controlled rotation of the feed screw moves the material from the feed point to the discharge point. Discrete control of the forward and reverse rotation of the feed screw controls the amount of material discharged through the outlet. In all cases, dot, bead or both, accurate and repeatable dispensing is accomplished in production.
The dispenser valve can be used to dispense fluid materials ranging from medium viscosity adhesives/epoxies potting compounds, to heavy viscosity and filled pastes. BeamWorks' selective assembly systems are available with Single or Dual Dispenser Assemblies.